Universal Photonics, Inc.
FLP Microfinishing GmbHHall 3.1 - Stand 710

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  • Machining
    • Ultraprecision machining
    • Centring/rounding
    • Polishing
    • Grinding/lapping
    • Sawing/cutting
  • Auxiliary materials and tools for optics and optoelectronics
    • Lapping and grinding media
    • Polishing agents
    • Diamond pellets
    • Adhesives, optical and glass
    • Adhesives, UV curing
UNICER 1000, CERIUM OXIDE POLISHING POWDER, GREATER PRODUCTIVITY
The latest addition to UNIVERSAL PHOTONICS’ extensive line of premium cerium oxide polishing powders, UNICER 1000, is engineered to service a wide range of applications where high quality surface finish and increased productivity are the ultimate goal. Its formula, the unique ...more

FLP Wafer 1300 - 1700 nano
The newly developed FLP Wafer 1300 - 1700 is a double-sided flat polishing machine for processing wafers and glass wafers. For the first time, chemically resistant granite polishing discs have been used. They guarantee a very high accuracy of the tool precision. The servo drives are ...more